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Touch the future with SEI Laser in drupa

  • Publicado el 06 de Julio de 2016

SEI LASER impressed the Paper Industry with the models PaperOne 5000, 3500 and with PACKMASTER OEM WD at DRUPA 2016 held in Düsseldorf (Germany) from 31st May 2016 to 10th June 2016. Digital die-cutting and creasing have now become a reality and can express themselves at a higher level. Specializing in the production of innovative laser based solutions SEI Laser, whose headquarters are in Bergamo, has launched its business challenge to the world of Paper Converting: the new model PaperOne is mainly designed for Paper Converting industries and printers that are seeking an important technological partner.

PaperOne 5000 (B2 format: up to 530 x 750mm) and PaperOne 3500 (extended B3 format up to 350 x 1000mm) are digital die-cutting and creasing systems equipped with automatic loading/unloading units. They are perfectly sized to be integrated with the most common digital printers present on the market.SEI Laser die-cutting of paper and cardboard is synonymous with accuracy and perfection and is the outcome of over 30 years’ experience and over 8,000 laser systems installed worldwide. The innovative “patent pending” solution PRO-CREASER PaperOne (in cooperation with ManMat) also aroused great interest at DRUPA 2016. In line creasing is the unique solution currently out on the market that exploits a male-female matrix that obtains a traditional result.

SEI Laser was not only present with its own stand (stand 12 D23) but was also hosted in the hall of Hewlett and Packard (HP). Thousands of visitors were given the opportunity to appreciate real time laser die-cutting and creasing that is now state of the art in the sector “from digital to packaging “. But that’s not all: as a matter of fact, SEI Laser digital converting doesn’t end with the solutions for Paper Converting: PACKMASTER OEM WD is the professional answer to applications such as micro-piercing, easy-opening and kiss cut required by the growing Flexible Packaging market.

 

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